Low-Chlorine, High-Purity, Low-Viscosity Electronic-Grade Bisphenol A Epoxy Resin
Shanghai Feimi Hi-Tech Materials has developed a low-chlorine, high-purity, low-viscosity Bisphenol-A epoxy resin, produced using proprietary precision purification and molecular weight control processes. While strictly controlling total and hydrolyzable chlorine content, the product achieves a room-temperature viscosity of approximately 4500 mPa·s—only one-half to one-third that of standard general-purpose Bisphenol-A epoxy resins (such as DER 331 or E-51). Offering excellent fluidity, air-release properties, and filler wetting capabilities, this resin significantly reduces the risk of electrochemical corrosion, making it an ideal base resin for electronic and electrical potting, motor insulation impregnation, and high-thermal-conductivity adhesives.
Typical properties
| Parameter | EP-HA1 | EP-HA2 | EP-HA3 | EP-HA4 |
|---|---|---|---|---|
| Appearance | 无色透明液体Transparent liquid | 无色透明液体Transparent liquid | 无色透明液体Transparent liquid | 无色透明液体Transparent liquid |
| 色泽(APHA) Color | ≤30 | ≤30 | ≤30 | ≤30 |
| 环氧当量(g/mol) EEW | 170~176 | 170~176 | 170~176 | 155~170 |
| 粘度(25℃,mPa·s) Viscosity | 3000~5500 | 3000~5500 | 2800~5500 | 1500~3500 |
| 水解氯(ppm)Hydrolyzed chlorine | <300(典型值=100~200) | <200(典型值=70~150) | ≤100(典型值=45~85) | <150(典型值=70~100) |
| 总氯(ppm)Total chlorine | ≤900 | ≤600 | ≤300 | ≤300 |
| 挥发物% Volatiles | <0.2 | <0.2 | <0.2 | <0.2 |
| 低温结晶性Low temperature crystallization | 结晶crystallization | 结晶crystallization | 结晶crystallization | 低结晶Low crystallization |
Core Advantages
- Low viscosity and strong penetrating power:** With a room-temperature viscosity of approximately 4500 mPa·s and low flow resistance, the material rapidly penetrates motor windings and complex microporous structures without the need for excessive reactive diluents, ensuring complete, bubble-free encapsulation.
- High purity and low chlorine content:** Hydrolyzable and total chlorine residues are strictly controlled; this effectively inhibits ion migration and metal circuit corrosion under conditions of high temperature, high humidity, and strong electric fields, thereby ensuring the long-term reliability of electronic components.
- Excellent powder encapsulation and compatibility with high thermal conductivity:** The material exhibits strong wetting properties toward thermally conductive and insulating fillers—such as alumina, silica powder, and boron nitride—allowing for significantly higher filler loading. This reduces the coefficient of thermal expansion (CTE) and enhances the system's thermal conductivity.
Product Applications
- Motor Insulating Varnish: Vacuum Pressure Impregnation (VPI) for high-speed motors, drive motors for new energy vehicles, and transformer coils.
- Electronic Encapsulation: Protective potting for sensors, power modules, IGBT modules, and high-voltage electronic components.
- Structural Adhesives: Die-attach adhesives, module bonding adhesives, and high-strength structural adhesives for electronics.
- Thermal Interface Materials: High-thermal-conductivity potting compounds, base materials for thermal grease, and thermally conductive structural adhesives.
- Advanced Composites: Impregnation, pultrusion, and filament winding processes for carbon fiber and glass fiber composites.
Storage and Handling
Please refer to the MSDS.
Shelf Life and Storage Method
- At least 24 months from the date of manufacture.
- Store in a sealed container in a cool, dry place away from light; avoid prolonged exposure to air and moisture.
- Crystallization may occur during storage at low temperatures. The product can be used normally after melting by heating to 80–110°C
FAQ
- Q1: What processing advantages do low-viscosity Bisphenol-A resins offer compared to conventional Bisphenol-A epoxy resins (such as DER 331)? A: Conventional DER 331 typically has a viscosity of 11,000–14,000 mPa·s. Formulating high-filler or solvent-free systems often requires large amounts of diluents, which can compromise the heat resistance and mechanical strength of the cured product. Feimi Materials' low-viscosity Bisphenol-A resin reduces viscosity to approximately 4,500 mPa·s, maintaining excellent flowability with little to no diluent, thereby balancing superior processing characteristics with high-performance cured properties.
- Q2: What is the significance of low hydrolyzable chlorine content for electronic-grade encapsulation adhesives and insulating varnishes? A: Hydrolyzable chlorine in epoxy resins can dissociate into chloride ions (Cl⁻) under conditions of heat, humidity, or electric fields, triggering electrochemical corrosion that leads to open circuits or short circuits in chips or motor copper windings. Low-hydrolyzable-chlorine resins significantly reduce ion concentrations, enhancing the device's weather resistance and service life in harsh environments.
- Q3: Does Feimi Materials provide sample testing and customized formulation services? A: Yes, we do. Shanghai Feimi Materials operates professional R&D and application laboratories, offering global B2B customers sample trials and technical selection advice, as well as customized product development services tailored to specific viscosity, epoxy equivalent, or testing standard requirements.
