Micronized Substituted Urea Latent Accelerators for DICY-Cured Epoxy Systems | Ecat® Series Manufacturer

Products Summary:

Shanghai Feimi Materials specializes in R&D and manufacturing of high-performance Substituted Urea Epoxy Accelerators, including Ecat-06, Ecat-08, Ecat-11, Ecat-12, and Ecat-13. Engineered with proprietary synthesis technology, our Ecat® series significantly lowers the activation energy of Dicyandiamide (DICY) systems—enabling low-temperature, rapid curing (100°C–140°C) while maintaining exceptional room-temperature latency (shelf life up to 12 months). Perfect for 1K structural adhesives, composite prepregs, and latent potting compounds with zero compromise on lap shear strength or Tg. Custom formulations and micronized particle sizing available.

Products Introduction

Traditional imidazole and tertiary amine accelerators often suffer from short pot life and rapid viscosity buildup at room temperature, leading to premature gelation in DICY systems. Shanghai Feimi’s proprietary Ecat® Series Substituted Urea Accelerators solve this trade-off.Keyed to remain chemically inert under ambient conditions, the Ecat® series grants one-component (1K) epoxy formulations and composite prepregs months of storage stability. Upon reaching its specific deblocking temperature (100°C–140°C), the accelerator rapidly unleashes catalytic activity, accelerating the DICY-epoxy crosslinking reaction. The resulting cured matrix exhibits dense crosslinking, high lap shear strength, and superior Glass Transition Temperature ($T_g$) retention. Compatible with DICY, acid anhydrides, and modified amine hardeners, Ecat® accelerators seamlessly integrate into Bisphenol A, Bisphenol F, Isocyanate-modified, and Novolac epoxy resins.

Product Advantages

• High Efficiency at Low-to-Medium Curing TemperaturesLowers the required cure temperature of traditional DICY systems from 170°C–180°C down to 100°C–130°C, drastically reducing thermal energy consumption and accelerating production cycle times.
• Exceptional Low/Room-Temperature LatencyStays completely stable below the deblocking temperature without triggering epoxy ring-opening. Provides ultra-stable viscosity profile at 25°C or lower storage, meeting demanding shelf-life requirements for prepregs and structural adhesives.
• Uncompromised Mechanical Strength & High Tg RetentionDelivers a controlled exothermic profile that mitigates micro-cracks and internal stress caused by peak exotherms. The resulting crosslinked network delivers outstanding tensile shear strength, impact resistance, and highTg.
• Micronized Particle Size & Ultra-Narrow DistributionFeatures exceptional dispersibility in resin matrices and DICY suspensions. Excellent anti-settling capability ensures consistent performance across large composite structures and thin adhesive films.

Typical Properties

注：
[1] Standard liquid bisphenol A epoxy + 7 PHR Dicy + 1 PHR accelerator

Products Applications

• 1K Epoxy Structural Adhesives.Ideal for automotive body bonding, rail transit, SMT surface mounting, and heavy-duty industrial structural adhesives requiring fast thermal cure and high shear strength.
• Carbon Fiber & Glass Fiber Prepregs.Tailored for sporting goods, wind turbine blades, automotive composites, and aerospace components where long room-temperature shelf life and rapid autoclave/molding processing are mandatory.
• Latent Epoxy Potting Compounds.Enables single-component, heat-cured encapsulation for transformers, inductors, electronic modules, and electric motor stators.
• Epoxy Powder Coatings & Adhesive Films.Suitable for heavy-duty anti-corrosion powder coatings, electrical insulation coatings, and latent hot-melt adhesive films.

Storage, Handling

• Handling & Safety Instructions: Please refer to the Safety Data Sheet (SDS / MSDS) for detailed hazard identification and safe handling practices.

Shelf Life & Storage Conditions

Minimum 12 months from the date of manufacture when stored in original unopened containers in a cool, dry, and well-ventilated area away from heat and direct sunlight.

FAQ

• Q1: What are the main advantages of Substituted Urea Accelerators (Ecat® Series) compared to Imidazole Accelerators in 1K DICY systems? A: While imidazoles offer strong catalytic reactivity, they suffer from poor latency at ambient temperatures, causing rapid viscosity increase and limiting pot life to a few days or weeks. Shanghai Feimi’s Ecat® substituted ureas remain completely dormant at room temperature—extending shelf life up to 6–12 months—and only activate upon heating to their specified deblocking temperature, delivering the perfect balance of long latency and fast thermal cure.
• Q2: How do I select the right grade among Ecat-06, Ecat-08, Ecat-11, Ecat-12, and Ecat-13 for my adhesive or prepreg formulation? A: Grade selection depends on your target cure temperature, cycle time, and shelf life: Ecat-11: Highest reactivity with the lowest deblocking temperature (~100°C), ideal for low-temperature fast-curing adhesives. Ecat-08 & Ecat-13: General-purpose, balanced grades offering excellent 120°C cure speed paired with outstanding room-temperature stability. Ecat-06 & Ecat-12: Ultra-latent grades with higher activation thresholds and extended shelf lives (6 and 12 months at room temperature, respectively), tailored for high-stability composite prepregs and adhesive films under ambient/summer conditions.
• Q3: Does Shanghai Feimi offer custom particle micronization or pre-blended DICY/Accelerator packages? A: Yes. Backed by an experienced fine chemical R&D team, Shanghai Feimi offers tailor-made formulation services. Beyond supplying standalone substituted ureas, we provide ultra-fine micronization, custom DSC kinetic profiling, and pre-dispersed Masterbatch / Pre-mix packages (Substituted Urea + DICY) tailored to your manufacturing process.