Liquid Latent Accelerator Ecat-05: Non-gas Anhydride Curing & Non-Discoloring Epoxy Systems

Product Summary

Shanghai Feimi Material Technology Co., Ltd. specializes in R&D and supply of Liquid Latent Accelerator Ecat-05. Formulated for direct solubility in epoxy resins and anhydride hardeners, Ecat-05 completely eliminates container/drum bloating caused by CO2 gassing in anhydride systems.When used with Methyl Hexahydrophthalic Anhydride (MHHPA), it maintains exceptional optical clarity and non-discoloration. Ecat-05 offers broad compatibility across anhydride, DDS, and dicyandiamide (DICY) curing systems, providing an extended pot life and shelf stability at ambient temperatures, while enabling rapid thermal curing at 120°C.Ideal for epoxy-anhydride pultrusion composites, 1K structural adhesives, prepregs, and electronic encapsulants/potting compounds. Customized formulation services are available. Liquid Latent Accelerator Ecat-05: High-Efficiency Curing Accelerator for Epoxy-Anhydride / DDS / DICY Systems with Extended Pot Life, Ultra-Fast 120°C Thermal Curing, and Colorless Clarity in MHHPAIndependently developed by Shanghai Feimi Material Technology, Ecat-05 Liquid Latent Accelerator directly addresses key industry pain points associated with conventional solid catalysts—such as dispersion difficulty, particle settling, and container bloating caused by $CO_2$ decarboxylation during anhydride storage.As a fully liquid catalyst, Ecat-05 dissolves directly into epoxy resins or anhydride hardeners, greatly simplifying blending and compound preparation. Designed as a versatile, broad-spectrum latent catalyst, Ecat-05 performs impeccably across anhydride, aromatic amine (DDS), and dicyandiamide (DICY) systems.At room and intermediate temperatures, Ecat-05 exhibits strong chemical latency, granting formulations exceptionally long pot life and storage stability. Upon heating to 120°C, the catalyst activates instantly to release robust catalytic activity, achieving rapid thermal curing. Ecat-05 delivers outstanding resin/hardener compatibility and precise thermal sensitivity, making it the preferred choice for pultrusion, 1K structural adhesives, prepregs, and latent potting applications.

Product Advantages

• 100% Liquid Form & Complete Anti-Bloating SolutionOvercomes traditional side reactions where amine/imidazole accelerators induce CO2 gassing and drum swelling in anhydride packaging. Ecat-05modified molecular structure prevents CO2generation, ensuring safe storage and transport of pre-mixed anhydride hardeners.
• Direct Miscibility with Zero Particle SettlingAs a liquid additive, it blends seamlessly into resins or hardeners without requiring high-shear milling or three-roll mills. Completely eliminates settling, caking, and local curing defects caused by uneven solid dispersion.
• Extended Pot Life & Superior Storage StabilityDemonstrates exceptional ambient latency. Formulated 1K adhesives and anhydride pre-mixes maintain long working time (pot life) and shelf life, ensuring sufficient window for mold filling, fiber wetting, and long-distance transport.
• Fast 120°C Thermal Response & High ProductivityHighly sensitive to thermal activation. Rapidly unblocks at 120°C to trigger fast curing, significantly shortening in-mold cycle times or baking schedules, thereby accelerating production throughput.

Typical Properties

Curing product performance

Products Applications

• Epoxy-Anhydride Pultrusion Composites: Ideal for wind turbine cable cores, rebar, and pultruded profiles. Delivers long resin bath life, rapid 120°C in-mold cure, and bloat-free anhydride pre-mix storage.
• 1K Structural Epoxy Adhesives: Designed for automotive body bonding, surface-mount electronics, and heavy-duty industrial structural bonding requiring extended shelf life and fast heat curing.
• High-End Composite Prepregs: Engineered for carbon fiber and glass fiber prepregs, maintaining stable room-temperature tack while enabling fast compression molding under heat.
• Latent Epoxy Potting & Encapsulation Compounds: Applied in single-component latent potting formulations for transformers, inductors, motor coils, and electronic modules.

Storage & Handling Instructions

• Handling & Safety: Please refer to Safety Data Sheet (SDS) / Material Safety Data Sheet (MSDS).

Shelf Life & Storage:

• Minimum 12 months from production date. Keep sealed in a cool, shaded, and dry environment. Avoid contact with air and moisture.

FAQ

• Q1: How does Ecat-05 eliminate the "drum swelling/bloating" issue in traditional anhydride systems?A: Traditional tertiary amines or imidazole accelerators often induce subtle anhydride ring-opening and decarboxylation side reactions during room-temperature storage, releasing carbon dioxide (CO2) gas that causes sealed drums to swell or rupture. Ecat-05 utilizes proprietary latent blocking technology that remains chemically inert to anhydrides at ambient temperatures. This prevents CO2generation completely, ensuring absolute safety during storage and transport of pre-mixed anhydride hardeners.
• Q2: How does Ecat-05 perform in Epoxy-DDS (Diaminodiphenyl Sulfone) systems?A: Aromatic amine hardeners like DDS (3,3'-DDS or 4,4'-DDS) are widely used in high-temperature prepregs and structural adhesives but possess low reactivity, typically requiring curing temperatures above 180°C. Adding Ecat-05 lowers the activation energy of DDS curing significantly while maintaining strong ambient latency. This allows efficient curing at 120°C without sacrificing the high Glass Transition Temperature (Tg) characteristic of DDS networks.
• Q3: Does Shanghai Feimi Material offer custom formulation support for Ecat-05 across different resin systems?A: Yes. Our experienced R&D and technical service team not only supplies Ecat-05, but also provides customized formulation tuning and process guidance based on your specific operational requirements—such as line speed in pultrusion, extended summer storage life for 1K adhesives, or tailored DSC exothermic peak behavior.