Acceralator and stabilizer

Modified Imidazole Latent Accelerator Ecat-14 | One-Component Epoxy Curing Agent -Shanghai Feimi Material

micronized Ecat-14 modified imidazole latent accelerator for 1-component epoxy systems. Offers long shelf life at room temperature & fast heat curing at 120°C. Ideal for prepregs, structural adhesives, and potting. Custom formulations available.

改性咪唑潜伏性促进剂Ecat-14

Ecat-14 Modified Imidazole Latent Accelerator & Hardener: Extended Shelf Life at Room Temp, Rapid Heat Curing

Product Summary

Shanghai Feimi Material’s Ecat-14 is a high-performance modified imidazole latent accelerator engineered to solve industry challenges like premature gelation, short pot life, and exothermic runaway in one-component (1K) epoxy formulations. Utilizing proprietary chemical blocking and physical modification, Ecat-14 comes as a micronized powder with exceptional dispersibility and suspension stability in epoxy resin systems. Ecat-14 serves a versatile dual function: it works as a primary curing agent for 1K epoxy resins and as a highly efficient latent accelerator for anhydrides, aromatic amines (DDS), and dicyandiamide (DICY) systems. It delivers robust latency at ambient temperatures to maximize storage stability, yet instantly unblocks at 120°C to trigger rapid thermal curing with high crosslinking density. The micron-sized particles suspend evenly in liquid resins without causing microscopic curing flaws, ensuring full compatibility with Bisphenol A, Bisphenol F, Novolac, and modified epoxy resins.

Product Advantages

  • Micronized Powder & Excellent Dispersion Stability.Precision-milled with uniform particle size distribution, Ecat-14 disperses effortlessly into epoxy resins across various viscosities. It resists agglomeration and settling over long periods, ensuring micro-level curing homogeneity.
  • Exceptional Latency & Room-Temperature Shelf Life.Proprietary imidazole chemistry blocks reactive sites, maintaining high chemical inertness at room temperature (25°C) and during transit. It suppresses viscosity rise and extends the shelf life of 1K epoxy formulations.
  • Fast Heat-Triggered Curing at 120°C.Features a sharp thermal activation profile. Upon reaching the activation threshold, it rapidly releases high reactivity—drastically shortening cycle times in oven baking and compression molding to boost throughput.
  • Dual Functionality & Broad Catalytic Acceleration.Functions both as a standalone 1K epoxy hardener and a high-efficiency accelerator for DICY, anhydride, and DDS systems. It lowers cure temperatures while increasing the glass transition temperature (Tg) and mechanical strength of the cured network.

Typical properties

项目 / Parameter指标 / Specification
外观 Appearance白色粉体
有效成分含量 Active Content>97%
推荐用量 Recommended Dosage1~3%
熔点 Melting Point (℃)>240
粒径 Particle Size (D98) (μm)<=10

Curing products performance

配方与性能项目 / Formulations & Properties质量 (g)
NPEL-128 环氧100
Ecat-14 [2]5
填料或气硅2
凝胶时间 Gel time (150℃ 秒)~108
固化条件 Cure Condition150℃,2h
玻璃化转变温度 Tg (DSC 10℃/min) (℃)~153
潜伏性 23℃ (days) Latency~150

Product Applications

  • One-Component (1K) Epoxy Structural Adhesives.Ideal for SMT surface-mount adhesives, automotive body structural bonding, and high-strength industrial adhesives. Combines extended storage stability with fast thermal curing at 120°C.
  • Composite Prepregs.Suited for carbon fiber and glass fiber prepregs. Ensures tack retention and viscosity stability during ambient or refrigerated storage while delivering rapid heat-press molding upon heating.
  • Latent Epoxy Potting Compounds.Designed for 1K electrical insulation potting in electric motors, transformers, sensors, and electronic modules. Yields void-free, dense structures with outstanding dielectric properties.

Handling & Post-Treatment:

  • Please refer to the Safety Data Sheet (SDS / MSDS) for detailed handling and safety instructions.

Shelf Life & Storage Conditions:

  • Minimum 12 months from the date of manufacture when stored properly.
  • Keep tightly sealed in a cool, dark, and dry environment. Protect against exposure to moisture and direct air moisture.

FAQ

  • Q1: How does Ecat-14 compare to unmodified imidazoles (e.g., 2-PZ, 2-E4MZ)? A: Unmodified imidazoles exhibit extreme reactivity at room temperature, causing resins to gel within hours or days, making them unsuitable for 1K systems. Ecat-14 utilizes chemical modification and blocking to neutralize ambient reactivity. This gives formulated 1K adhesives exceptional shelf life at room temperature, activating rapidly only when heated above 120°C.
  • Q2: How effective is Ecat-14 as an accelerator in DICY-cured systems? A: DICY typically requires high curing temperatures. Adding Ecat-14 lowers the DICY curing threshold down to 120°C while fully retaining DICY's inherent latency, high bond strength, and thermal resistance.
  • Q3: Can Feimi Chemical provide custom formulations or technical assistance for specific resin systems? A: Yes. Feimi R&D and technical service team provides both pure Ecat-14 supply and custom formulation tailoring. We can optimize gel times, activation temperatures, peak exotherms, and targeted shelf-life requirements based on your specific application.