Ultra-Fine Micronized Dicyandiamide (DICY) Latent Epoxy Curing Agent,Precision Latency & Superior Reactivity: Unlocking Uncompromised Storage Stability for Premium 1K Epoxy Systems.
Product Summary
Shanghai Feimi Materials specializes in the R&D and precision micronization of Dicyandiamide (DICY) Latent Epoxy Curing Agents. Featuring ultra-fine and narrow particle size distribution, high purity, outstanding room-temperature latency, and rapid thermal activation, our micronized DICY enables superior single-component (1K) epoxy stability, high shear strength, and excellent heat/chemical resistance. Widely used in carbon fiber composite prepregs, single-component structural adhesives, high-performance powder coatings, automotive structural foams, and copper-clad laminates (CCL). All products comply with RoHS and REACH standards.
Product Overview
Developed by Shanghai Feimi Materials, our Micronized Dicyandiamide (DICY) Latent Curing Agent Series is engineered to overcome key processing bottlenecks of traditional coarse DICY grades—such as poor dispersion, particle settling, incomplete crosslinking, and inconsistent reaction kinetics.By utilizing advanced air-jet milling and precise particle classification technologies, our micronized DICY guarantees exceptionally uniform dispersion in Bisphenol A, Bisphenol F, and Novolac epoxy resins without solvent addition. As a classic latent hardener, DICY remains completely unreactive at ambient temperatures, offering extended shelf life (up to 6-12 months in 1K systems). Upon reaching its activation temperature (160°C-180°C, or 120°C-140°C when paired with imidazoles or urons as accelerators), it undergoes rapid crosslinking, yielding cured networks with exceptional Tg, high mechanical strength, excellent electrical insulation, and chemical durability.
Product Advantages
- Ultra-Fine Particle Size & Excellent DispersionMilled to precision micron/sub-micron levels with a tight particle distribution curve. Prevents settling during long-term storage and eliminates filtration blockages during composite infusion or prepreg manufacturing.
- Outstanding Ambient Latency & Extended Pot LifeInsoluble in epoxy resin matrix at room temperature, providing exceptional shelf-life stability for 1K epoxy adhesives, pastes, and prepregs without viscosity buildup.
- High Chemical & Thermal PerformanceCured epoxy networks exhibit high glass transition temperatures (Tg), outstanding mechanical toughness, superior lap shear strength, and robust electrical insulating properties.
- Versatile Compatibility & Synergistic AccelerationWorks seamlessly with various epoxy resin matrices and can be combined with substituted ureas (urons), imidazoles, or organic acid hydrazides to lower activation temperature and accelerate cure speed.
- Strict Quality Control & Reliable Global SupplyProduced under strict ISO quality management systems. Guarantees batch-to-batch consistency in particle size (d50 / d90), moisture content, and chemical purity. Custom particle size milling services are available upon request.
Typical Specifications
| 项目 / Parameter | Ecure-32 | Ecure-33 | Ecure-34 |
|---|---|---|---|
| 外观 Appearance | 白色粉体White powder | 白色粉体White powder | 白色粉White powder |
| 粒径 Particle size(um) | D90<10 | D98<10 | D98<6 |
| 纯度 Purity | >94% | >94% | >94% |
| 熔点 Melting point | 209~212 | 209~212 | 209~212 |
| 活泼氢当量 AHEW (g/mol) | 21 | 21 | 21 |
| 适合使用量(NPEL-128:固化剂)Recommended Use Level | 100: 4~15 | 100: 4~15 | 100: 4~15 |
Product Applications
- Carbon Fiber & Glass Fiber Composites (Prepregs)Key latent curing agent for aerospace, automotive, sports equipment, and industrial wind-energy carbon fiber prepregs.
- Single-Component (1K) Structural Adhesives & PastesAutomotive body-in-white structural adhesives, hem flange sealants, electronic chip bonding adhesives, and thermal conductive gap fillers.
- High-Performance Powder CoatingsFunctional anti-corrosion pipe coatings, rebar epoxy coatings, electrical insulation coatings, and decorative architectural powder finishes.
- Electronics & Electrical Laminates (CCL)FR-4 copper-clad laminates, PCB prepregs, encapsulated insulating varnishes, and electronic potting compounds.
Handling, Storage & Expiry
- Handling & Safety Instructions: Please refer to the Safety Data Sheet (SDS / MSDS) before handling. Avoid dust inhalation and maintain dry ambient handling conditions.
- Shelf Life & Storage Conditions:24 months from the manufacturing date in original sealed bags.Store in a cool, dry, and well-ventilated warehouse (30°C). Keep away from heat sources, direct sunlight, strong acids, and strong bases.
FAQ
- Q1: Why is micronization (fine particle size) so critical for Dicyandiamide (DICY) in 1K epoxy formulations?A: DICY is insoluble in epoxy resins at ambient temperature. Coarse DICY particles settle rapidly during storage and cause uneven localized crosslinking, leading to reduced shear strength and surface defects. Micronized DICY (d{90} < 10\mu\text{m}$ or $< 5\mu\text{m}$) stays homogenously suspended, dissolves rapidly upon reaching reaction temperatures, and delivers maximum crosslinking density and consistent mechanical performance.
- Q2: How can the curing temperature of DICY be lowered from 170°C to below 120°C?A: DICY inherently requires high thermal activation (160°C-180°C). By adding 1%-3% of latent accelerators：such as substituted ureas (urons like Fenuron/DCMU) or modified imidazoles,the reaction ring-opening threshold is lowered. This allows full curing at 120°C~130°C while retaining excellent room-temperature pot life.
- Q3: Does Shanghai Feimi Materials support custom particle size grinding and OEM packaging?A: Yes. Shanghai Feimi Materials possesses advanced air-jet micronization equipment and particle sizing analytics (laser diffraction). We offer customized particle size distribution (d50 / d90) tailored to your viscosity and process limits, along with custom moisture-proof B2B packaging options.
